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测试与分析 谢卓立 等·具有电磁屏蔽效能的导热塑料的研究进展
合材料,结果表明,当 LMPA 的体积分数为 50% 时, Manufacturing, 2021, 149:106 574.
复合材料的 EMI SE 和 TC 分别达到了 68.79 dB 和 6.38 [6] TAN X, LIU T, ZHOU W, et al. Enhanced Electromagnetic
Shielding and Thermal Conductive Properties of Polyolefin
W/(mk)。张萍 [24] 通过聚多巴胺(PDA)和葡萄糖在 Composites with a Ti 3 C 2 Tx MXene/Graphene Framework
PVDF 微球表面还原银离子,制备了 PVDF@PDA@ Connected by a Hydrogen-Bonded Interface[J]. ACS nano,
Ag 微球,并通过热压工艺制备了 PVDF@PDA@Ag/ 2022, 16(6):9 254-9 266.
[7] RAAGUL AN K, BRAVE E NT H R, KIM BM, e t a l .
LMPA 复合材料,结果表明,在银界面层的协同作用 An effective utilization of MXene and its effect on
下,热压加工中流动的 LMPA 定向包覆在微球表面, electromagnetic interference shielding: flexible, free-
形成了隔离结构,提升了复合材料的导热性能、降低 standing and thermally conductive composite from MXene–
PAT–poly(p-aminophenol)–polyaniline co-polymer[J]. RSC
了复合材料的线膨胀系数,且当 LMPA 的体积分数为
Advances, 2020, 10(3):1 613-1 633.
10% 时,复合材料的 EMI SE 和 TC 分别达到了 48.1 [8] JIN X, WANG J, DAI L, et al. Flame-retardant poly(vinyl
dB 和 1.79 W/(mk)。 alcohol)/MXene multilayered films with outstanding
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处于发展阶段,未广泛应用在生活中,一是因为制造
1 331.
工艺复杂、成本高 ;二是填料的增加会导致材料力学 [10] ZHANG Y, RUAN K, GU J, et al. Flexible Sandwich-
性能、加工性能降低。但是,随着 5G 时代的来临, Structured Electromagnetic Interference Shielding
Nanocomposite Films with Excellent Thermal Conductivities
电磁屏蔽 / 导热材料需求的增加,工艺技术的不断升
[J]. Small, 2021, 17(42):2101951.
级,国内相关产业链公司也将迎来新的增长机遇。未 [11] ZHANG Y, RUAN K, ZHOU K, et al. Controlled Distributed
来具有电磁屏蔽效能的导热材料在满足市场多重性能 Ti 3 C 2 Tx Hollow Microspheres on Thermally Conductive
的前提下会向轻量化方向发展,同时也会以危害较低 Polyimide Composite Films for Excellent Electromagnetic
Interference Shielding[J]. Advanced materials (Deerfield
的吸收损耗为主,减少反射损耗,创造出更加经济环
Beach, Fla.), 2023, 35(16).
保的电磁屏蔽 / 导热材料。 [12] Z HANG Y, TANG S, Z HANG Q, e t a l . Const ruc t i ng
interconnected asymmetric conductive network in TPU
fibrous film: Achieving low-reflection electromagnetic
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Core towards Tunable Thermoconductive and EMI Shielding PEI composites via constructing 3D microscopic continuous
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